Publications

  1. [EMSE’22] Characterizing Usages, Updates and Risks of Third-Party Libraries in Java Projects.
    Kaifeng Huang, Bihuan Chen, Congying Xu, Ying Wang, Bowen Shi, Xin Peng, Yijian Wu, and Yang Liu. Empirical Software Engineering, accepted, 2022. (An invited extended version of the ICSME'20 paper)

  2. [ASE’21] RepFinder: Finding Replacements for Missing APIs in Library Update.
    Kaifeng Huang, Bihuan Chen, Linghao Pan, Shuai Wu, and Xin Peng. In Proceedings of the 36th IEEE/ACM International Conference on Automated Software Engineering, Melbourne, Australia, 2021, p266-278

  3. [FSE’20] Interactive, Effort-Aware Library Version Harmonization.
    Kaifeng Huang, Bihuan Chen, Bowen Shi, Ying Wang, Congying Xu, and Xin Peng. In Proceedings of the 28th ACM Joint European Software Engineering Conference and Symposium on the Foundations of Software Engineering, Sacramento, California, United States, 2020, p518-529.

  4. [ICSME’20] An Empirical Study of Usages, Updates and Risks of Third-Party Libraries in Java Projects.

      🏆IEEE TCSE Distinguished Paper Award  

    Ying Wang, Bihuan Chen, Kaifeng Huang, Bowen Shi, Congying Xu, Xin Peng, Yijian Wu and Yang Liu. In Proceedings of the 36th IEEE International Conference on Software Maintenance and Evolution, Adelaide, Australia, 2020, p35-45.
  5. [ASE’18] CLDIFF: Generating Concise Linked Code Differences.

      🏆ACM SIGSOFT Distinguished Paper Award  

    Kaifeng Huang, Bihuan Chen, Xin Peng, Daihong Zhou, Ying Wang, Yang Liu, and Wenyun Zhao. In Proceedings of the 33rd IEEE/ACM International Conference on Automated Software Engineering, Montpellier, France, 2018, p679-690.
  6. [ICSA’20] DesignDiff: Continuously Modeling Software Design Difference from Code Revisions.
    Xiao Wang, Lu Xiao, Kaifeng Huang, Bihuan Chen, Yutong Zhao, and Yang Liu. In Proceedings of the IEEE International Conference on Software Architecture, Salvador, Bahia, Brazil, 2020, p179-190.

Education

  • Fudan University,Shanghai,PhD — Sept., 2016- Jan., 2022
    Software Engineering, School of Computer Science

  • Donghua University,Shanghai,Bachelor — Sept., 2012- Jul., 2016
    Electronics Engineering, School of Information Science and Technology

Awards

  • 2020 Scholarship of Academic Excellence, Fudan University
  • 2020 CCF Prototype Competition 2rd Prize
  • 2019 Scholarship of Academic Excellence, Fudan University
  • 2018 National Scholarship, Fudan University
  • 2018 CCF Prototype Competition 2rd Prize
  • 2017 Scholarship of Academic Excellence, Fudan University

Contact Me

Address:
  2005 Songhu Road, Yangpu District, Shanghai, China
Mail:
  kaifeng.h AT icloud.com